CS-3 System

At the heart of the CS-3 system is an innovative wafer packaging solution we refer to as the engine block. The engine block delivers power straight into the face of the wafer to achieve the required power density that could not be achieved with traditional packaging. It provides uniform cooling for the wafer via a closed internal water loop. All cooling and power supplies are redundant and hot-swappable so you stay up-and-running at full performance.